As Samsung helps Apple develop the M2 chip

maçã teria hired Samsung to help develop their next-generation M2 chips. Apple will unveil its M1 chip in 2020 on three different devices: the MacBook Air, the 13-inch MacBook Pro and the Mac mini. Apple also currently uses different versions of the M1 chip in MacBooks, Macs, and some iPad models.

The Apple M1 SoC is an ARM processor. It uses a different architecture compared to x86-based processors from AMD and Intel. However, the main advantage of using an ARM-based chip is its high efficiency. The Apple M1 SoC offers two of the highest wattage performance on the market. More powerful variants of the M1 chip, including the M1 Pro, M1 Max and M1 Ultra, have already taken this impression to an even higher level.

Apple is currently working on the next-generation M2 SoC. According to a report from a non-Korean publication ET News, Samsung Electro-Mechanics is collaborating with Apple on the development of the M2 chips. Samsung asked LG Innotek to turn to Apple’s processor packers to provide a high-spec substrate for the M1 SoC, which has already been a huge success. The publication also confirms previously leaked news about Apple launching at least new Mac computers with the updated M2 SoC, which should be announced in the first semester of 2022.

Samsung Electro-Mechanics will develop a Flip-Chip Ball Grid (FC-BGA) array for Apple M2 processors. It is a particular form of fiber-grade matrix that uses a flip chip, also known as a controlled crash chip connection. Simply put, it is a semiconductor substrate that is responsible for connecting the semiconductor chip to the main array. Some of the benefits of using Flip-Chips include high moisture resistance and better thermal conductivity.

Samsung Electro-Mechanics is the largest player in semiconductor packaging substrates in terms of technology and market participation. meets ET News, the chipmaker invested KRW 1.3 trillion (1.04 billion dollars) in its Vietnamese manufacturing unit in 2021 to increase production. Samsung Electro-Mechanics also deposited more than 300 billion KRW (US$241 million) on the FC-BGA substrate in March 2022. However, in an official announcement about the partnership with Apple, a voiceover said:We cannot confirm the information of our customers.”

Some of Samsung Electro-Mechanics, Ibiden and Unimicron, located in Japan and Taiwan respectively, are the other companies producing FC-BGA for Apple. LG Innotek, headquartered in South Korea, is another new manufacturer that has recently entered the space. It is currently not participating in the development of the M2 chip, but a recent report revealed that Apple is collaborating with LG Innotek to produce the lens for the iPhone 15. maçã the M2 processor will definitely be unveiled at the next WWDC 2022 virtual event in June.

Source: ET News

Leave a Reply

Your email address will not be published.